基本信息:
- 专利标题： 전자부품 실장 시스템 및 전자부품 실장방법
- 专利标题（英）：Electronic component mounting system and electronic component mounting method
- 专利标题（中）：电子元件安装系统和电子元件安装方法
- 申请号：KR1020097004020 申请日：2007-09-06
- 公开(公告)号：KR101292635B1 公开(公告)日：2013-08-16
- 发明人： 오카모토카주오 , 니시쇼이치 , 모리타타케시 , 히요시마사노리 , 토모야수카주히코
- 申请人： 파나소닉 주식회사
- 申请人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 专利权人： 파나소닉 주식회사
- 当前专利权人： 파나소닉 주식회사
- 当前专利权人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 代理人： 특허법인세신
- 优先权： JPJP-P-2006-245229 2006-09-11
- 国际申请： PCT/JP2007/067780 2007-09-06
- 国际公布： WO2008032756 2008-03-20
- 主分类号： H05K13/04
- IPC分类号： H05K13/04 ; H05K13/08 ; H05K3/34 ; H05K13/02
In a mounting system having a height measuring device and an electronic component mounting apparatus for measuring the height of the printed solder paste to the electrode, if the height of the solder paste is normal on the basis of the measurement result of measuring the height of the solder paste printed on the electrode determining whether or not, and also on the basis of the determination result of the determination of a main portion of the transfer of solder paste to the solder bumps, and transferring the paste to the electronic component held by the head mounted to a transfer if it is determined necessary. Thereby, in the case that target the substrate resulting in a lack of solder enjoying the cool breeze due to the printing defect in addition to enjoying the cool breeze titration of the solder mounting quality can be secured.
公开/授权文献:
- KR1020090051059A 전자부품 실장 시스템 및 전자부품 실장방법 公开/授权日：2009-05-20
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K13/00 | 专门适用于制造或调节电元件组装件的设备或方法 |
| --------H05K13/04 | .元件的安装 |