Each other to form a coating film of a different thickness at the same time, by applying the proper amount of the paste to the bumps, the present invention is to provide an efficient also a component mounting apparatus and component mounting method that can be performed with good bonding properties to the component mounting purposes. If the bump is formed is taken out by the head 16 with a first part and a second part forming a laminated structure mounted to overlap the substrate 13 from a component supply unit (1) for the transfer to the bumps of these parts, by elevating the placement head (16) maintaining the first part and the second part with respect to the paste transfer apparatus 5 that supplies the flux 10 to the film in the form of two types of different thickness to be applied by, by transferring the flux 10 on the bumps of a plurality of such components it will be supplied at the same time. This makes it possible to secure a proper amount of the paste to perform the component mounting to efficiently and good bonding properties. The component mounting apparatus, a bump, a paste, transfer