基本信息:
- 专利标题： 자석부착층을 갖는 점착테이프를 이용한 전자부품의 봉지 방법
- 专利标题（英）：Method for sealing electronic component using adhesive tape with magnetic receptive layer
- 专利标题（中）：使用粘合胶带密封电子元件与磁性接收层的方法
- 申请号：KR1020110083839 申请日：2011-08-23
- 公开(公告)号：KR101285852B1 公开(公告)日：2013-07-15
- 发明人： 문기정 , 김연수 , 엄상준
- 申请人： 도레이첨단소재 주식회사
- 申请人地址： 경상북도 구미시 *공단*로 *** (임수동, 도레이첨단소재 주식회사)
- 专利权人： 도레이첨단소재 주식회사
- 当前专利权人： 도레이첨단소재 주식회사
- 当前专利权人地址： 경상북도 구미시 *공단*로 *** (임수동, 도레이첨단소재 주식회사)
- 代理人： 특허법인 신지
- 主分类号： C09J7/02
- IPC分类号： C09J7/02 ; C09J9/00 ; C09J133/04 ; H01L21/58
The present invention relates to a method of manufacturing adhesive tape and electronic components using the same has a magnet layer, more particularly, to simplifying the semiconductor package process, and can reduce the cost of the process and the retainer surface and the carrier surface after the resin sealing process separate cleanly without leaving a residue can greatly improve the workability and also can be easily peeled off in the form of a vertical separation from the carrier, or mechanical device and by configuring the strong pressure-sensitive adhesive layer to the shear stress attached magnet which can secure the dimensional stability pressure-sensitive adhesive tape having a layer and a method for producing the electronic component using the same. Pressure-sensitive adhesive tape having a magnetic attachment layer according to the invention for this purpose is characterized in that it comprises a magnet layer (magnetic receptive layer) applied to the adhesive layer and the other surface of the base film coated on one surface of the base film and the base film do.
公开/授权文献:
- KR1020130022441A 자석부착층을 갖는 점착테이프를 이용한 전자부품의 봉지 방법 公开/授权日：2013-03-07
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C09 | 染料；涂料；抛光剂；天然树脂；黏合剂；其他类目不包含的组合物；其他类目不包含的材料的应用 |
| ----C09J | 黏合剂；一般黏合方法（非机械部分）；其他类目不包括的黏合方法；黏合剂材料的应用 |
| ------C09J7/00 | 薄膜或薄片状的黏合剂 |
| --------C09J7/02 | .在载体上 |