基本信息:
- 专利标题： 반도체 소자 밀봉용 에폭시 조성물 및 이로 밀봉된 반도체 장치
- 专利标题（英）：Epoxy Composition for Encapsulating Semiconductor Device and Semiconductor Device Encapsulated With the Same
- 专利标题（中）：用于封装半导体器件的环氧组合物和用其封装的半导体器件
- 申请号：KR1020110021039 申请日：2011-03-09
- 公开(公告)号：KR101234571B1 公开(公告)日：2013-02-19
- 发明人： 전현애 , 김환건 , 신승한 , 김윤주 , 정민재 , 박수진 , 탁상용 , 오창호
- 申请人： 한국생산기술연구원
- 申请人地址： 충청남도 천안시 서북구 입장면 양대기로길 **
- 专利权人： 한국생산기술연구원
- 当前专利权人： 한국생산기술연구원
- 当前专利权人地址： 충청남도 천안시 서북구 입장면 양대기로길 **
- 代理人： 특허법인씨엔에스
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; C08G59/24 ; C08G59/18 ; H01L23/29
The more in detail the present invention is molded strain is hardly containing naphthalene type epoxy dimer having improved moldability, curing characteristics and storage stability, the thermal expansion coefficient is low, the reliability and the formability and an epoxy composition, and which sealing excellent semiconductor semiconductor device It relates. According to the present invention, the epoxy compound (A), curing agent (B), curing accelerator (C) and in the epoxy composition containing a filler (D), 2 of naphthalene-based core unit of the epoxy compound (A) has the following general formula 1 a semiconductor device sealed semiconductor device is provided with an epoxy composition and the epoxy composition characterized in that a naphthalene-type epoxy dimer having a (unit). An epoxy composition comprising a naphthalene-type epoxy dimer of Formula 1 having excellent moldability and reliability hameuroseo using the epoxy composition according to the invention to have not only exhibit improved Warpage deformation characteristics, the low thermal expansion coefficient of the semiconductor element (device ) it can be produced.
公开/授权文献:
- KR1020120103042A 반도체 소자 밀봉용 에폭시 조성물 및 이로 밀봉된 반도체 장치 公开/授权日：2012-09-19
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L63/00 | 环氧树脂的组合物；环氧树脂衍生物的组合物 |