基本信息:
- 专利标题： 반도체소자 탑재용 패키지 기판과 그 제조방법
- 专利标题（英）：A package substrate and a manufacturing method for semiconductor element mounting
- 专利标题（中）：半导体元件安装封装基板及其制造方法
- 申请号：KR1020117001694 申请日：2009-09-29
- 公开(公告)号：KR101214357B1 公开(公告)日：2012-12-20
- 发明人： 타무라타다시 , 스기바야시마나부 , 스즈키쿠니지 , 오카노신이치
- 申请人： 히타치가세이가부시끼가이샤
- 申请人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 代理人： 특허법인원전
- 优先权： JPJP-P-2008-250303 2008-09-29; JPJP-P-2009-222739 2009-09-28
- 国际申请： PCT/JP2009/066919 2009-09-29
- 国际公布： WO2010035867 2010-04-01
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/48
The invention, in a case constituting the PoP, the degree of freedom of the package to combine large, the pattern design constraints also small, the upper package and to be connectable to the deeds at a high density between the bottom package, either the warp reduction, and high reliability an object of the semiconductor element mounting package substrate and for providing a method of manufacturing the same. The invention, and the adhesive attached to the cavity layer having an opening and a through-hole, and a cavity portion formed by the base layer laminated on the cavity floor, the opening by the adhesive, a via having a bottom formed by the through-hole having a semiconductor package substrate, wherein the adhesive is an elastomeric material, wherein the inner wall of the via is covered with a ground metal, and a semiconductor device package on the substrate and a manufacturing method for mounting a conductive resin is filled.
公开/授权文献:
- KR1020110036063A 반도체소자 탑재용 패키지 기판과 그 제조방법 公开/授权日：2011-04-06
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |