基本信息:
- 专利标题: 인쇄회로기판 장치
- 专利标题(英):Pcb device
- 专利标题(中):PCB设备
- 申请号:KR1020110023729 申请日:2011-03-17
- 公开(公告)号:KR101198318B1 公开(公告)日:2012-11-06
- 发明人: 천재권 , 천병욱
- 申请人: (주)솔루나 , 천재권
- 申请人地址: 경기도 화성시 팔탄면 터넉골로 ***-** ( )
- 专利权人: (주)솔루나,천재권
- 当前专利权人: (주)솔루나,천재권
- 当前专利权人地址: 경기도 화성시 팔탄면 터넉골로 ***-** ( )
- 代理人: 박종욱
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H05K1/18
The present invention discloses the Seebeck effect and the Peltier one to apply the effect to improve the heat dissipation structure of a printed circuit board for mounting a heat-generating part the printed circuit board device, the printed circuit board device, a circuit pattern on one side and forms a heat generating component a printed circuit board for mounting; Thermoelectric power generation unit has a high temperature section and a low temperature section are joined structure outputting the current by heat transfer from the printed circuit board by the Seebeck effect, in which the high-temperature portion installed to contact the rear surface to the printed circuit board; Heat absorbing portion and a heat radiating portion having a bonded structure heat transfer the thermoelectric power generation unit heat by the current the heat absorbing portion endothermic and the heat radiating portion generated according to the Peltier effect and add the endotherm, which is installed in contact with the low-temperature portion the thermal development portion cooling part; And be installed in contact with the radiator cooling the heat-radiator portion to release heat transferred from the heat dissipating part; it characterized in that it comprises a.
公开/授权文献:
- KR1020120105965A 인쇄회로기판 장치 公开/授权日:2012-09-26
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K7/00 | 对各种不同类型电设备通用的结构零部件(机壳、箱柜或拉屉入H05K5/00) |
--------H05K7/20 | .便于冷却、通风或加热的改进 |