基本信息:
- 专利标题： 얇은 다이 탈착 및 취출용 제어 및 모니터링 시스템
- 专利标题（英）：Control and monitoring system for thin die detachment and pick-up
- 专利标题（中）：控制和监控系统，用于薄膜分离和取样
- 申请号：KR1020110009965 申请日：2011-02-01
- 公开(公告)号：KR101156475B1 公开(公告)日：2012-06-18
- 发明人： 이프시우핑 , 총치밍 , 찬만와이 , 웡쿼크와이
- 申请人： 에이에스엠 어쌤블리 오토메이션 리미티드
- 申请人地址： 홍콩, 콰이 청, 씩스틴 쿵 입 스트리트, 웨스톤 센터, **플로어
- 专利权人： 에이에스엠 어쌤블리 오토메이션 리미티드
- 当前专利权人： 에이에스엠 어쌤블리 오토메이션 리미티드
- 当前专利权人地址： 홍콩, 콰이 청, 씩스틴 쿵 입 스트리트, 웨스톤 센터, **플로어
- 代理人： 장훈
- 优先权： US12/701,065 2010-02-05
- 主分类号： H01L21/301
- IPC分类号： H01L21/301 ; H01L21/78
During removal of the die from the adhesive tape, the inner and outer portions of the first side of the die in contact with the adhesive tape is supported by the support surface. The collet is in contact with the inner and outer portion of the second side of the die opposite the first side. The support surface is retracted from the outer portion of the die is the outer portion of the second side of the die to bend away from the collet support is only to support the internal parts of the die. Is applied to the vacuum suction force of the collet from pulling the outer portion of the die towards the collet, a vacuum suction pressure is monitored until the pressure threshold that indicates that the external portion of the die in contact with the collet is reached. Thereafter, the collets are raised over the life of the die by a vacuum suction force to completely remove the die from the adhesive tape.
公开/授权文献:
- KR1020110091469A 얇은 다이 탈착 및 취출용 제어 및 모니터링 시스템 公开/授权日：2011-08-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料 |
| --------------H01L21/26 | ....用波或粒子辐射轰击的 |
| ----------------H01L21/301 | .....把半导体再细分成分离部分，例如分隔 |