基本信息:
- 专利标题： 구리배선 패턴 형성방법 및 거기에 이용하는 산화구리 입자 분산액
- 专利标题（英）：Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same
- 专利标题（中）：形成铜线图案和铜氧化物颗粒分散体的方法用于其中
- 申请号：KR1020107008688 申请日：2008-10-20
- 公开(公告)号：KR101120743B1 公开(公告)日：2012-03-22
- 发明人： 나카코히데오 , 야마모토카즈노리 , 마치이요우이치 , 쿠마시로야스시 , 요코자와슌야 , 에지리요시노리 , 마스다카츠유키
- 申请人： 히타치가세이가부시끼가이샤
- 申请人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 代理人： 특허법인원전
- 优先权： JPJP-P-2007-273779 2007-10-22
- 国际申请： PCT/JP2008/068960 2008-10-20
- 国际公布： WO2009054343 2009-04-30
- 主分类号： H05K3/12
- IPC分类号： H05K3/12 ; H01B1/20 ; H01B1/22
The oxidation of the copper particles, without substantially using the required was a surface treatment agent to the dispersion, electromigration is less were, unit price of the material itself suppresses the occurrence of cracks by using cheap copper particles, and forming a copper wiring pattern having low resistance method and to provide a copper oxide particle dispersion using it. On a substrate, by using a dispersion liquid by dispersing copper-based particles having a copper oxide surface return the copper oxide in the process of forming a random pattern of copper-based particles, the surface of the pattern was reduced by atomic hydrogen in copper, a copper wiring pattern forming method comprising the step of sintering between the particles are reduced to copper metal produced.
公开/授权文献:
- KR1020100057091A 구리배선 패턴 형성방법 및 거기에 이용하는 산화구리 입자 분산액 公开/授权日：2010-05-28
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上，而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
| ----------H05K3/12 | ..应用印刷技术涂加导电材料的 |