The present invention loads incoming to, receives the wafer from the wafer delivery section delivery to the process chamber of the load lock chamber of the process of heat treatment processes and the wafer for delivering wafers to be performed in a single module, and, passing the processed wafer lock in the chamber, the upper module and a position which is provided between the position is fixed with the first upper wafer support pad and the first upper wafer support pad of the first wafer thermal processing unit and a second upper wafer support pad to be moved up and down reciprocating fixed the claim 1 is provided between a lower wafer support pad and the first lower wafer support pad and the second wafer thermal processing unit includes a lower module including a second lower wafer support pad to be moved up and down reciprocally. According to the invention, the load-lock within the wafer support pad, a first upper wafer chamber support pads, the second upper wafer support pad, the first lower wafer support pad and a second having a lower wafer support pad, and the first support upper wafer pad and the first lower wafer support pad is a wafer to be processed in the fixed seat, the second a top wafer support pad and the second lower wafer support pad is such that the wafer is cooled by moving the wafer to be mounted after processing portion heat treatment the wafer transfer and the heat treatment it is possible to provide a load lock chamber are performed simultaneously.