基本信息:
- 专利标题： 접착제 조성물
- 专利标题（英）：Adhesive composition
- 专利标题（中）：粘合剂组合物
- 申请号：KR1020097013369 申请日：2008-06-09
- 公开(公告)号：KR101098204B1 公开(公告)日：2011-12-23
- 发明人： 아쿠츠야스시 , 야마다야스노부 , 미야우치고우이치
- 申请人： 데쿠세리아루즈 가부시키가이샤
- 申请人地址： Gate City Osaki East Tower *F, *-**-*, Osaki, Shinagawa-ku, Tokyo Japan
- 专利权人： 데쿠세리아루즈 가부시키가이샤
- 当前专利权人： 데쿠세리아루즈 가부시키가이샤
- 当前专利权人地址： Gate City Osaki East Tower *F, *-**-*, Osaki, Shinagawa-ku, Tokyo Japan
- 代理人： 특허법인코리아나
- 优先权： JPJP-P-2007-154966 2007-06-12
- 国际申请： PCT/JP2008/060525 2008-06-09
- 国际公布： WO2008152998 2008-12-18
- 主分类号： C09J4/02
- IPC分类号： C09J4/02 ; C09J7/02 ; C09J201/00 ; H01L21/60
摘要：
플렉시블배선기판의배선금속표면이나배선간에노출된폴리이미드표면에대해, 그들의표면이비교적평활한상태에서도양호한접착강도를나타낼수 있는접착제조성물은, 열가소성수지와다관능아크릴레이트와라디칼중합개시제를함유하고, 추가로식 (1) 로나타내는말단에우레탄잔기를갖는단관능우레탄아크릴레이트를함유한다. 여기에서, R은수소원자또는메틸기이고, R은 2 가의염화수소기이며, R는치환되어도되는저급알킬기이다.
摘要（英）：
For the polyimide surface exposed between the wiring metal surface or the wiring of the flexible wiring substrate, the adhesive composition with their surface can exhibit good adhesive strength even at a relatively smooth state, and containing a polyfunctional acrylate and a radical polymerization initiator and a thermoplastic resin and it contains a monofunctional urethane acrylate having a urethane moiety at the terminal thereof represented by the formula (1) in addition. Here, R 0 is a hydrogen atom or a methyl group, R 1 is a divalent group of hydrogen chloride, R 2 is a lower alkyl group which may be substituted.
公开/授权文献:
- KR1020090099062A 접착제 조성물 公开/授权日：2009-09-21
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C09 | 染料；涂料；抛光剂；天然树脂；黏合剂；其他类目不包含的组合物；其他类目不包含的材料的应用 |
| ----C09J | 黏合剂；一般黏合方法（非机械部分）；其他类目不包括的黏合方法；黏合剂材料的应用 |
| ------C09J4/00 | 基于至少具有1个可聚合的碳—碳不饱和键的非高分子有机化合物的黏合剂 |
| --------C09J4/02 | .丙烯酰基单体 |