基本信息:
- 专利标题： 반도체 칩을 사용한 반도체 장치
- 专利标题（英）：Semiconductor device using semiconductor chip
- 专利标题（中）：使用半导体芯片的半导体器件
- 申请号：KR1020047000385 申请日：2003-04-16
- 公开(公告)号：KR100966537B1 公开(公告)日：2010-06-29
- 发明人： 이소카와신지
- 申请人： 로무 가부시키가이샤
- 申请人地址： 일본 교토후 교토시 우교구 사이잉 미조사키죠 **
- 专利权人： 로무 가부시키가이샤
- 当前专利权人： 로무 가부시키가이샤
- 当前专利权人地址： 일본 교토후 교토시 우교구 사이잉 미조사키죠 **
- 代理人： 하상구; 하영욱
- 优先权： JPJP-P-2002-00146657 2002-05-21
- 国际申请： PCT/JP2003/004821 2003-04-16
- 国际公布： WO2003098709 2003-11-27
- 主分类号： H01L33/62
- IPC分类号： H01L33/62 ; H01L23/12
As seen in a plane and one of the first electrode (2) formed on one of the corners of the approximately crystal substrate (1a) on the square, crystal placed between the other corner portion positioned on the diagonal with respect to said one corner part substrate a semiconductor chip (1) having two side edges the second electrode (3) formed along a (1a), and the first electrode (2) and second electrode (3), a circuit board 10 a first lead portion 15 formed on the surface, a plurality of second lead parts when the (16a, 16b) to be joined by the respective solder paste (20), one first lead part 15 of narrow width is determined It extends so as to cross the first sides of the substrate (1a), a plurality of second lead portions (16a, 16b) extends in the opposite direction as the first lead section 15, and the first lead section 15, and a second lead portion (16a, 16b) are arranged as chiwoochyeoseo suitable dimensions to each other. Thereby, to prevent the semiconductor chip 1 by the surface tension of the molten solder is fixed to the energy position at the surface of the circuit board 10.
公开/授权文献:
- KR1020050007282A 반도체 칩을 사용한 반도체 장치 公开/授权日：2005-01-17