基本信息:
- 专利标题： 수지 물질을 조직화하고, 수지 물질을 데스메어하고제거하기 위한 헤테로사이클릭 질소 화합물 및 글리콜함유 조성물
- 专利标题（英）：Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material
- 专利标题（中）：含有杂环氮化合物和二元醇的组合物用于纹理树脂材料和去除和除去树脂材料
- 申请号：KR1020020012077 申请日：2002-03-07
- 公开(公告)号：KR100833104B1 公开(公告)日：2008-05-29
- 发明人： 그레이브스존이. , 초한배린더 , 허스트데보라브이. , 풀마크에이.
- 申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨
- 申请人地址： 미국 매사추세츠주 ***** 말보로 포리스트 스트리트 ***
- 专利权人： 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨
- 当前专利权人： 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨
- 当前专利权人地址： 미국 매사추세츠주 ***** 말보로 포리스트 스트리트 ***
- 代理人： 최규팔; 이은선
- 优先权： GB01057181 2001-03-08
- 主分类号： C08J7/02
- IPC分类号： C08J7/02
The present invention relates to heterocyclic nitrogen and glycol containing solvent swell compositions and methods of use thereof. It solvent swell compositions and may contain a flash point (flash point) solvent and water. Solvent swell composition is used to condition the resin material for the etching to form a porous structured (porous textured) surface on a resin material (resinous material). Porous tissue thereby depositing the metal on the resin material so that complete binding (high integrity bond) is formed between an organized resin material and metal deposition. Such coupling between the metal and the resin material prevents the metal and resin are combined de-lamination. The heterocyclic nitrogen and glycol solvent swell compositions also Mare Des the resin material from the substrate (desmear). The heterocyclic nitrogen and glycol solvent swell compositions may be used to process the resin material used in the manufacture of printed circuit boards. Metal may be deposited on the resin material by a suitable plating organized.
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08J | 加工；配料的一般工艺过程；不包括在C08B，C08C，C08F，C08G或C08H小类中的后处理 |
| ------C08J7/00 | 高分子物质成形制品的化学处理或涂层 |
| --------C08J7/02 | .用溶剂，如溶胀剂 |