The present invention is to improve the reliability of the flip chip (flip chip) relates to solder for connecting junction structure, grow in particular by changing the shape of the connecting pad to which the solder is applied to the size of the solder joints to be formed through the reflow process, the solder joint number relates to a solder bonding structure, is any solder joints and responds to be connected composed of at least two pattern regions with separate the spacing pad is formed above (the "bridge-type pattern") with connection pad of such a shape to this fit It is configured to include an interlocking metal bump. This solder joint structure may allow printing with a semiconductor chip and the connection pads provided with a metal bump circuit sufficiently reliable solder bond between the substrate formed by the solder joints of sufficient size on the fine pattern of the narrower width. In addition, because of the reliability can be constructed through the conventional process of forming a connecting pad number when the operation does not require an additional step and the solder joint without increasing the process can be sufficiently secured. Bridge phenomenon, solder, reflowed bumps, bonding, flip-chip