基本信息:
- 专利标题： 칩부품설치체 및 반도체장치
- 专利标题（英）：Chip mounting device and semiconductor device
- 专利标题（中）：芯片安装器件和半导体器件
- 申请号：KR1020050048477 申请日：2005-06-07
- 公开(公告)号：KR100684374B1 公开(公告)日：2007-02-20
- 发明人： 나카자와다이보
- 申请人： 르네사스 일렉트로닉스 가부시키가이샤
- 申请人地址： *-**, Toyosu *-chome, Koutou-ku, Tokyo, Japan
- 专利权人： 르네사스 일렉트로닉스 가부시키가이샤
- 当前专利权人： 르네사스 일렉트로닉스 가부시키가이샤
- 当前专利权人地址： *-**, Toyosu *-chome, Koutou-ku, Tokyo, Japan
- 代理人： 조의제
- 优先权： JPJP-P-2004-00171049 2004-06-09
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
칩, 실장체, 반도체, 도전성 접착제, 단락
Disclosure is to provide a chip part assembly and a semiconductor device that may increase the amount of the conductive adhesive increase the contact area between the chip component and an electrically conductive adhesive, to prevent short circuit between the pad portion and the adjacent part. The present invention is a printed wiring board 1 in the chip component (2) is mounted chip component mounting body through a conductive adhesive (3) on the chip parts are, at the same time the printed circuit board ridge of the legs having a leg (2b) a pad portion disposed toward the (1a) side, and is characterized in that the angle (α) formed between the pad surface and a surface adjacent to the ridge line of each section of the chip component is to be mounted such that an acute angle. Chip, mounted body, a semiconductor, an electrically conductive adhesive, short
公开/授权文献:
- KR1020060049175A 칩부품설치체 및 반도체장치 公开/授权日：2006-05-18
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |