基本信息:
- 专利标题: 평면 매립형 반도체 광 증폭기의 제작 방법
- 专利标题(英):Method for manufacturing semiconductor optical amplifier having planar buried heteostructure
- 专利标题(中):具有平面掩埋结构的半导体光放大器的制造方法
- 申请号:KR1020030072957 申请日:2003-10-20
- 公开(公告)号:KR100520796B1 公开(公告)日:2005-10-13
- 发明人: 이동훈 , 심은덕 , 김기수 , 박문호
- 申请人: 한국전자통신연구원
- 申请人地址: 대전광역시 유성구 가정로 *** (가정동)
- 专利权人: 한국전자통신연구원
- 当前专利权人: 한국전자통신연구원
- 当前专利权人地址: 대전광역시 유성구 가정로 *** (가정동)
- 代理人: 신영무
- 主分类号: H01S5/30
- IPC分类号: H01S5/30
The present invention is the the etching step using the insulating film pattern was that the growth of the lower cladding layer, the lower waveguide layer and an upper cladding layer on a substrate according to the manufacturing method of the double waveguide structure is an integrated planar buried semiconductor optical amplifier mode converter flattening the surface so as to grow the the step of patterning a part of the thickness of the upper portion cladding layer, the lower waveguide layer and the lower cladding layer to form a lower waveguide, a planarization layer on the etched portion of the lower clad layer, the lower waveguide layer and an upper clad layer phase and a total space layer on the surface after removing the insulating layer pattern, the upper waveguide layer and a first and a step of growing a cladding layer, said first cladding layer by an etching process using a dielectric pattern, the upper waveguide layer and the spacer layer to a patterned by forming an upper waveguide having a tapered region horizontal, the first of the upper waveguide And a step of growing a second current blocking layer on the exposed first current blocking layer in the portion other than the dielectric pattern below dingcheung, after growing the first current blocking layer on the etched portion of the upper waveguide layer and the spacer layer, after removal of the dielectric pattern formed in the second cladding layer on the entire upper surface, and a step of forming each electrode in the second cladding layer and the substrate.
公开/授权文献:
- KR1020050037710A 평면 매립형 반도체 광 증폭기의 제작 방법 公开/授权日:2005-04-25