基本信息:
- 专利标题： 반도체 장치
- 专利标题（英）：Semiconductor device
- 专利标题（中）：반도체장치
- 申请号：KR1020020028612 申请日：2002-05-23
- 公开(公告)号：KR100480515B1 公开(公告)日：2005-04-06
- 发明人： 키무라나오토
- 申请人： 르네사스 일렉트로닉스 가부시키가이샤
- 申请人地址： *-**, Toyosu *-chome, Koutou-ku, Tokyo, Japan
- 专利权人： 르네사스 일렉트로닉스 가부시키가이샤
- 当前专利权人： 르네사스 일렉트로닉스 가부시키가이샤
- 当前专利权人地址： *-**, Toyosu *-chome, Koutou-ku, Tokyo, Japan
- 代理人： 최달용
- 优先权： JPJP-P-2001-00156540 2001-05-25
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
The semiconductor device according to the invention a number directly mounted on at least one of the plurality of electronic components including semiconductor integrated circuit chips, is disposed between the electronic component and the package, the main surface of one of the electronic component (major face) of having the intermediate substrate, and the intermediate substrate are each at least to the electrodes of the plurality of first to be connected with the electronic component, the second electrode a plurality of for external connection, and the electrode of the first and the second and having an inner connecting wiring for connecting between the electronic components comprising the connection between the electrode on the one principal surface of the.
公开/授权文献:
- KR1020020090314A 반도체 장치 公开/授权日：2002-12-02
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/52 | .用于在处于工作中的器件内部从一个组件向另一个组件通电的装置 |