基本信息:
- 专利标题： 침식현상이 개선된 금속배선 연마용 슬러리 조성물
- 专利标题（英）：Slurry composition of low erosion for chemical mechanical polishing of metal lines
- 专利标题（中）：用于抛光腐蚀问题的抛光金属线的浆料组合物
- 申请号：KR1020010087485 申请日：2001-12-28
- 公开(公告)号：KR100449614B1 公开(公告)日：2004-09-22
- 发明人： 김원래 , 이재석 , 도원중 , 노현수 , 이길성
- 申请人： 제일모직주식회사
- 申请人地址： 경상북도 구미시 구미대로 ** (공단동)
- 专利权人： 제일모직주식회사
- 当前专利权人： 제일모직주식회사
- 当前专利权人地址： 경상북도 구미시 구미대로 ** (공단동)
- 代理人： 문혜정; 김학제
- 主分类号： C09K3/14
- IPC分类号： C09K3/14
The present invention is substituted for that of the slurry for polishing used in the semiconductor device (device) CMP (Chemical Mechanical Polishing / Planarization) for the purpose of planarization of the wafer during the manufacturing process, more particularly to a metal oxide fine powder, and iodine containing aromatic ring the compounds of structure, hydrogen peroxide, phosphorus compounds, polyacrylic acid, erosion, comprising a nitric acid and deionized water (erosion) developing the present invention relates to an improved metal wiring polishing slurry composition, the use of slurry polishing composition of the present invention high it is possible to achieve a high polishing rate and polishing uniformity, and high dispersion stability facilitates long-term storage, in particular to solve the erosion problem that occurs during polishing.
公开/授权文献:
- KR1020030057111A 침식현상이 개선된 금속배선 연마용 슬러리 조성물 公开/授权日：2003-07-04
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C09 | 染料；涂料；抛光剂；天然树脂；黏合剂；其他类目不包含的组合物；其他类目不包含的材料的应用 |
| ----C09K | 不包含在其他类目中的各种应用材料；不包含在其他类目中的材料的各种应用 |
| ------C09K3/00 | 不包含在其他类目中的材料 |
| --------C09K3/14 | .防滑材料；研磨材料 |