基本信息:
- 专利标题： 전기적으로 전도성인 접착성 트랜스퍼들
- 专利标题（英）：Electrically conductive adhesive transfers
- 专利标题（中）：전기적으로전도성인접착성트랜스퍼들
- 申请号：KR1020017004325 申请日：1999-09-28
- 公开(公告)号：KR100422315B1 公开(公告)日：2004-03-11
- 发明人： 디바스티아니노만피.
- 申请人： 챠트팩, 인코포레이티드
- 申请人地址： 미국 메사츄세츠 ***** 리드스 원 리버 로드
- 专利权人： 챠트팩, 인코포레이티드
- 当前专利权人： 챠트팩, 인코포레이티드
- 当前专利权人地址： 미국 메사츄세츠 ***** 리드스 원 리버 로드
- 代理人： 박장원
- 优先权： US09/166,494 1998-10-05
- 国际申请： PCT/US1999/022656 1999-09-28
- 国际公布： WO2000020214 2000-04-13
- 主分类号： H05K3/40
- IPC分类号： H05K3/40
摘要：
An electrically functional adhesive transfer for use in the manufacture and/or the design of flexible membrane circuits. Electrical circuit elements, instead of being printed directly upon polyester film substrates, are printed upon a carrier sheet. A pressure sensitive adhesive is applied over the exposed surfaces of the printed circuit pattern on the carrier sheet and covered by a release paper. The circuit later is applied to any desired substrate by peeling away the release paper and mounting the circuit by means of the pressure sensitive adhesive. The carrier sheet typically is peeled away after the circuit is adhesively bonded to the substrate. The carrier sheet desirably is transparent or translucent in order to facilitate visual alignment of the circuit pattern with the substrate to which it is being bonded.
摘要（中）：
用于柔性薄膜电路的制造和/或设计的电功能粘合剂转移。 电路元件不是直接印刷在聚酯薄膜基底上，而是印刷在载体薄片上。 将压敏粘合剂施加在载体片上的印刷电路图案的暴露表面上并用防粘纸覆盖。 通过剥离隔离纸并通过压敏粘合剂安装电路，该电路随后被施加到任何期望的基板上。 载体片通常在电路被粘合到基板上之后被剥离。 理想的载体片材是透明或半透明的，以便于电路图案与其所粘合的衬底的视觉对准。
公开/授权文献:
- KR1020010075586A 전기적으로 전도성인 접착성 트랜스퍼들 公开/授权日：2001-08-09
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/40 | .用于对印刷电路或印刷电路之间提供电连接而形成印制元件 |