基本信息:
- 专利标题： 반도체칩의 제거방법 및 제거장치
- 专利标题（英）：Semiconductor chip removal process and apparatus
- 专利标题（中）：半导体芯片拆卸过程和设备
- 申请号：KR1019930022172 申请日：1993-10-25
- 公开(公告)号：KR100129119B1 公开(公告)日：1998-04-07
- 发明人： 후지모또히로아끼 , 우메다신지 , 다께하시신이쯔
- 申请人： 파나소닉 주식회사
- 申请人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 专利权人： 파나소닉 주식회사
- 当前专利权人： 파나소닉 주식회사
- 当前专利权人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 代理人： 김영철
- 优先权： JP92-318,232 1992-11-27; JP93-137,611 1993-06-08
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
The end of said can is adhered by the resin on the substrate, relates to a removal method and apparatus of the semiconductor chip to remove the semiconductor chip is chip electrodes are electrically connected by the substrate electrodes and the wires of the substrate in a substrate is arranged so that the wire worked on the substrate electrode side of the wire leading end of the cutting tool is in that the cutting wire by pushing on the butt portion and decrease the bonding strength of the resin by heating the resin and bond the semiconductor chip to the substrate state leaving the hameuroseo semiconductor chip pressing the semiconductor chip to the side by a tool for chip removal from the substrate sikimyeo characterized in that the removal with the cutting a semiconductor chip separated from the wire board.
公开/授权文献:
- KR1019940012555A 반도체칩의 제거방법 및 제거장치 公开/授权日：1994-06-23
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |