基本信息:
- 专利标题: 加工対象材料の切断方法
- 专利标题(英):JPWO2017199784A1 - The method of cutting the target material
- 申请号:JP2017546747 申请日:2017-05-09
- 公开(公告)号:JPWO2017199784A1 公开(公告)日:2018-05-31
- 发明人: 山下 憲二 , 難波江 宏一
- 申请人: エルシード株式会社
- 申请人地址: 愛知県名古屋市天白区梅が丘3丁目1804番地の2
- 专利权人: エルシード株式会社
- 当前专利权人: エルシード株式会社
- 当前专利权人地址: 愛知県名古屋市天白区梅が丘3丁目1804番地の2
- 代理人: 重泉 達志
- 优先权: JP2016099161 2016-05-17
- 主分类号: H01L21/304
- IPC分类号: H01L21/304 ; B23K26/53 ; B28D5/00
Finally cut surface obtained to provide a method for cutting a machining target material without largely deviated from the planned cutting planes. After the laser beam to cut surface of the processing target material is absorbed to form a modified region, a method for cutting a machining target material is cut along a processing target material to cut surface, Law of cut surface line, without the normal to the predetermined angle in a predetermined low index plane of the processing target material, as the distance crack distance of irradiation line between the laser beam along a predetermined low index plane is not extended, form a plurality of lines of the cracking suppressing processing step of forming side by side modified region, between the modified area is formed line-shaped at crack suppression processing step, the modified regions of the additional linear, irradiation of the adjacent laser beam cracking along the distance between the lines in a predetermined low-index plane is to contain, and cracking promotion processing step of forming a distance that extension.
公开/授权文献:
- JP6246444B1 加工対象材料の切断方法 公开/授权日:2017-12-13
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料 |
--------------H01L21/26 | ....用波或粒子辐射轰击的 |
----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的,例如腐蚀、抛光、切割 |
------------------H01L21/304 | ......机械处理,例如研磨、抛光、切割 |