Was formed using a copper particle paste can reliably sinter the inside of the bonding material, excellent in oxidation resistance of the copper particles, and the electronic component module including the junction reliable joint, and its production to provide a method.
Range particle size peak of 0.1~5.0μm of the particle size distribution in the range of the average crystallite diameter before sintering 30 to 100 nm, the copper particles having no inhibiting dispersant agglomeration the particle surface When using copper particles paste containing an organic compound which exhibits a reducing action at the firing temperature at which the sintering kidou particles, bonding the external terminals to the connection target.
Further, the external terminals 33 provided to the electronic component 31, via the bonding material 34, in the electronic component module 30 having an electrically and mechanically connected to the structure in connection object 36, the bonding material, said copper particles It is formed by baking the paste, the average crystallite diameter and copper sintered body in the range of 60 to 150 nm.