Substrate or other semiconductor chip coating step of coating a semiconductor component adhesive (1), the semiconductor chip laminating step of laminating a semiconductor chip through the coated semiconductor component adhesive (2), the substrate or other semiconductor chip a step of uniformly wetting and spreading a semiconductor component adhesive for the entire area to be bonded on the semiconductor chip (3), and a curing step of curing the semiconductor component adhesive (4), in the coating step (1) region for applying the semiconductor component adhesives are 40 to 90% of the region for bonding the semiconductor chip, a semiconductor component adhesive has spread wetted area immediately after the semiconductor chip laminating step (2) is joining the semiconductor chip 60% or more than 100% of the area, the viscosity of 0.5rpm by an E type viscometer semiconductor component adhesive in the step (3) to spread wet in 1~30Pa · s A semiconductor chip manufacturing method of the laminate that.