Impact resistance and excellent in miniaturization correspondence, and a good dimensional accuracy, providing high multilayer ceramic electronic component reliability, multilayer ceramic substrate, and a method for manufacturing a multilayer ceramic electronic component.
Comprising: a ceramic base material layer is formed by laminating a shrinkage suppression layer, a partial region of the first main surface 14 of the multilayer ceramic element assembly 4 having a predetermined conductor pattern, a non-metallic inorganic powder and a resin, provided with a pedestal 11 which is fixed to the first main surface 14 by the resin, whereas the side end surface is disposed via-hole conductor 17 to the base portion 11 so as to be exposed on the surface of the base portion 11, the surface of the pedestal 11 on one side end surface 17a of the via-hole conductors 17 exposed to, via a conductive bonding material to bond the surface mount electronic components such as semiconductor elements 13.
Between the surface mount electronic device and the seat portion, the resin of the same composition as the resin in the base portion is a filled structure.
Mounting a semiconductor element as a surface mount electronic device to the base unit.