基本信息:
- 专利标题： Production of adhesive substrate for precise lapping of thin material
- 专利标题（中）：生产用于精细切削材料的粘合基材
- 申请号：JP12811480 申请日：1980-09-16
- 公开(公告)号：JPS5753120A 公开(公告)日：1982-03-30
- 发明人： WATANABE KATSURA
- 申请人： Citizen Watch Co Ltd
- 专利权人： Citizen Watch Co Ltd
- 当前专利权人： Citizen Watch Co Ltd
- 优先权： JP12811480 1980-09-16
- 主分类号： H03H3/02
- IPC分类号： H03H3/02 ; H03H9/02
摘要：
PURPOSE:To make high-precision adhesion possible, by producing an adhesive substrate with a wax penetrating layer after the processing for an average uniform roughened surface. CONSTITUTION:After the surface of an adhesive substrate 3 is roughened up to >=10S by the sand blast method, a liquid with a wax or the like 2 dissolved is coated onto grooves 4 uniformly by spray to form the adhesive substrate 3. Next, a work 1 (such as a thin crystal wafer) is put on the adhesive substrate 3, and a constant or more load is applied and the substrate 3 is heated at a temperature higher than the melting point of the wax to cause the wax 2, which is not required for adhesion on the adhesive substrate 3, to penetrate into grooves 4, thereby realizing high-precision adhesion.
摘要（中）：
目的：为了使高精度的粘合成为可能，通过在经过平均均匀的粗糙化表面的加工后，制造具有蜡透过层的粘合剂基材。 构成：通过喷砂法将粘合剂基材3的表面粗糙化至> = 10S后，将溶解有蜡等的液体2通过喷雾均匀地涂布在凹槽4上，形成粘合基材3.接着， 将工件1（例如薄晶片）放在粘合剂基板3上，施加恒定或更大的负荷，并且将基板3在高于蜡的熔点的温度下加热以引起蜡2， 粘附在粘合基材3上不需要渗透到槽4中，从而实现高精度的粘合。
公开/授权文献:
- JPS5749966U JPS5749966U - 公开/授权日：1982-03-20
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H03 | 基本电子电路 |
| ----H03H | 阻抗网络，例如谐振电路；谐振器 |
| ------H03H3/00 | 专用于制造阻抗网络、谐振电路、谐振器的设备或方法 |
| --------H03H3/007 | .用于制造机电谐振器或网络 |
| ----------H03H3/02 | ..用于制造压电或电致伸缩谐振器或网络 |