基本信息:
- 专利标题: OPTICAL DEVICE MACHINING APPARATUS
- 申请号:JP12091398 申请日:1998-04-30
- 公开(公告)号:JPH11314184A 公开(公告)日:1999-11-16
- 发明人: TOKUMURA KEIU , JITSUNO TAKAHISA , TAMAMURA HISASHI
- 申请人: NARUKKUSU KK , SONY TEKTRONIX CORP
- 专利权人: NARUKKUSU KK,SONY TEKTRONIX CORP
- 当前专利权人: NARUKKUSU KK,SONY TEKTRONIX CORP
- 优先权: JP12091398 1998-04-30
- 主分类号: G01B11/24
- IPC分类号: G01B11/24 ; B23K26/00 ; G01J9/00 ; G02B3/00 ; H01S3/00
摘要:
PROBLEM TO BE SOLVED: To enable easy and highly accurate machining for the surface to be worked even if the optical device has a large wave aberration. SOLUTION: This apparatus is equipped with a laser generator 3, which machines the surface 2 of a workpiece 1 by irradiating it with an ultraviolet laser L of a short wave length, and a shack hartmann wave front instrument 4 which has a lens array with a large number of micro lenses arranged to make the reference beam of a desired characteristic enter the lens array, and which thereby measures the wave front from a difference between the image- forming position of a reference beam emitted from each micro lens by making the reference beam of a desired characteristic enter the lens array and the image-forming position of a measured beam emitted from each micro lens by making the measured beam enter the lens array through the surface 2 to be worked. Then, the irradiation of the ultraviolet laser L is optimally controlled, on the basis of the deviation of the image-forming position of the measured beam, using as a reference the image-forming position of the reference beam obtained from the shack hartmann wave front instrument 4; and, simultaneously, controlled positionally by a controller 6 is the driving mechanism 5 that relatively moves the ultraviolet laser L and the workpiece 1.
信息查询:
EspacenetIPC结构图谱:
G | 物理 |
--G01 | 测量;测试 |
----G01B | 长度、厚度或类似线性尺寸的计量;角度的计量;面积的计量;不规则的表面或轮廓的计量 |
------G01B11/00 | 以采用光学方法为特征的计量设备 |
--------G01B11/24 | .用于计量轮廓或曲率 |