PROBLEM TO BE SOLVED: To obtain a self-adhesive film which can be used for cutting the back side of a semiconductor wafer almost without staining the front side by forming a self-adhesive layer comprising a specific self-adhesive polymer and a specified amt. of a cross-linker on one side of a substrate film. SOLUTION: A self-adhesive layer contg. 100 pts.wt. self-adhesive polymer and 0.3-15 pts.wt. cross-linker (e.g. a polyglycidyl ether of sorbitol) having functional groups reactive with the functional groups of the polymer is formed on one side of a substrate film. The self-adhesive polymer is obtd. by copolymerizing 67-98.9 pts.wt. main monomer (e.g. methyl acrylate), 1-30 pts.wt. comonomer (e.g. methacrylic acid) having functional groups reactive with the cross-linker, and 0.1-3 pts.wt. water-sol. comonomer represented by the formula (wherein R1 is H, a 1-25C alkyl group, or a 6-25C alkenyl group; R2 is a 2-5C alkenyl group; R3 is H or a 2-5C alkenyl group; R4 is a 2-5C alkylene group; (n) is 1-100; and M is NH4 , Na , or K ) (e.g. Aqualon HS-20, a trade name).