基本信息:
- 专利标题： 銅張積層板の製造方法
- 专利标题（英）：Method for producing a copper-clad laminate
- 申请号：JP2017513163 申请日：2017-01-31
- 公开(公告)号：JP6178035B1 公开(公告)日：2017-08-09
- 发明人： 立岡 歩 , 細川 眞 , 川口 彰太
- 申请人： 三井金属鉱業株式会社
- 申请人地址： 東京都品川区大崎1丁目11番1号
- 专利权人： 三井金属鉱業株式会社
- 当前专利权人： 三井金属鉱業株式会社
- 当前专利权人地址： 東京都品川区大崎1丁目11番1号
- 代理人： 高村 雅晴; 加島 広基; 武石 卓
- 优先权： JPPCT/JP2016/082658 2016-11-02 JP2016040795 2016-03-03
- 国际申请： JP2017003344 JP 2017-01-31
- 主分类号： C23C8/40
- IPC分类号： C23C8/40 ; C23C22/63 ; C23C28/00 ; C23C26/00 ; H05K1/03 ; H05K1/09 ; C23C22/83
While using a thermoplastic resin having a low dielectric constant, the manufacturing method of the copper clad laminate joined copper foil and the resin at a high adhesion is provided. The method includes the steps of providing a roughened copper foil having a roughened surface having a formed fine unevenness acicular crystals containing copper oxide and cuprous oxide on at least one side, roughening treatment of copper the roughened surface of the foil, and a step of obtaining a copper-clad laminate adhered a sheet of a thermoplastic resin. Roughened surface is determined, at the time of pasting the thermoplastic resin, a copper oxide thickness is determined by continuous electrochemical reduction analysis (SERA) is 1 to 20 nm, and by continuous electrochemical reduction analysis (SERA) cuprous oxide thickness being is characterized in that it is a 15～70Nm.
公开/授权文献:
- JPWO2017150043A1 銅張積層板の製造方法 公开/授权日：2018-03-15