发明专利
JP5509370B1 Resin foam, the foam member, the foamed member laminate and electrical or electronic equipment
有权
基本信息:
- 专利标题： Resin foam, the foam member, the foamed member laminate and electrical or electronic equipment
- 申请号：JP2013104992 申请日：2013-05-17
- 公开(公告)号：JP5509370B1 公开(公告)日：2014-06-04
- 发明人： 清明 児玉 , 誠 齋藤 , 和通 加藤
- 申请人： 日東電工株式会社
- 专利权人： 日東電工株式会社
- 当前专利权人： 日東電工株式会社
- 优先权： JP2012121291 2012-05-28; JP2012275505 2012-12-18; JP2013104992 2013-05-17
- 主分类号： C08J9/12
- IPC分类号： C08J9/12 ; B32B5/18 ; B32B27/00 ; B32B27/36 ; C08J9/36
【解決手段】本発明の樹脂発泡体は、下記で定義される層間剥離強度が１０Ｎ／２０ｍｍ以上であり、５０％圧縮時の反発力が０．１〜４．０Ｎ／ｃｍ
2 であり、平均セル径が１０〜２００μｍであり、最大セル径が３００μｍ以下であることを特徴とする。
層間剥離強度：シート状の樹脂発泡体を、２３℃雰囲気下、粘着テープ（商品名「Ｎｏ．５６０３」、日東電工株式会社製）の粘着面に貼り付け、２ｋｇローラ、１往復の条件で圧着した後、上記樹脂発泡体を剥離角度９０°、引張速度０．３ｍ／ｍｉｎの条件で上記粘着テープより剥離させた際の剥離強度【選択図】なし
The present invention has fine cell structure, even soft resin foam, it is possible to suppress or prevent the foam breakdown at the time of peeling from the carrier tape, processability and transportability of holding the carrier tape to provide a resin foam which is excellent in.
A resin foam of the present invention is an interlayer peeling strength which is defined by the following 10 N / 20 mm or more, the repulsive force at 50% compression is
0.1~4.0N / cm 2, mean cell diameter of 10 to 200 m, wherein the maximum cell diameter is 300μm or less.
Delamination strength: a sheet-like resin foam, 23 ℃ atmosphere, the pressure-sensitive adhesive tape (trade name "No.5603", manufactured by Nitto Denko Corporation) stuck to the adhesive surface of the crimp in the 2kg roller, one round trip of conditions after, the resin foam peel angle 90 °, a tensile speed of 0.3 m / min conditions the adhesive peel strength BACKGROUND oF tHE INVENTION upon were detached from the tape without the