PROBLEM TO BE SOLVED: To provide an electrode connection structure capable of suppressing the occurrence of migration defects during electrode connection, where an electrode of one circuit formation body is connected to an electrode of another circuit formation body using insulating connection resin. SOLUTION: The electrode connecting structure has the first circuit formation body having an array of a plurality of first electrodes extending in a wiring direction, the second circuit formation body having a plurality of second electrodes disposed opposite the plurality of first electrodes of the first circuit formation body and electrically connected, and the insulating connection resin disposed in an opposition region of the first and second circuit formation bodies to connect the both together, and the first circuit formation body is so formed that the width of a region between adjacent first electrodes is larger than a center part of the opposition region nearby at least one end of the opposition region. COPYRIGHT: (C)2009,JPO&INPIT