发明专利
JP4577309B2 Resin sealed semiconductor package of manufacturing methods and manufacturing equipment
有权
基本信息:
- 专利标题： Resin sealed semiconductor package of manufacturing methods and manufacturing equipment
- 申请号：JP2006519298 申请日：2004-11-08
- 公开(公告)号：JP4577309B2 公开(公告)日：2010-11-10
- 发明人： 英雄 伊藤 , 吉孝 廣瀬 , 玉也 生方
- 申请人： 住友ベークライト株式会社
- 专利权人： 住友ベークライト株式会社
- 当前专利权人： 住友ベークライト株式会社
- 优先权： JP2004136535 2004-04-30
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; B29B13/02 ; B29C31/06 ; B29C31/08 ; B29C43/18 ; B29L31/34
摘要：
The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater by rotating an agitating rod projecting from a tip of an agitating plunger, the agitated and melted resin composition is taken out and formed in the form of a package under pressure, and the formed resin composition is fitted to a compression plunger inside a cavity of a lower molding unit, a semiconductor package is molded by sealing under pressurizing with the compression plunger. Even when the wires are thinned and arranged at a higher density, the above producing method can provide such method and apparatus for producing the resin-sealed type semiconductor packages that produce less flowing of the wires.
公开/授权文献:
- JPWO2005106942A1 樹脂封止型半導体パッケージ並びにその製造方法及び製造装置 公开/授权日：2008-03-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/56 | ....封装，例如密封层、涂层 |