基本信息:
- 专利标题： Photosensitive resin composition
- 申请号：JP14709799 申请日：1999-05-26
- 公开(公告)号：JP4258690B2 公开(公告)日：2009-04-30
- 发明人： 一夫 武内 , 右副 田島 , 江津 竹内 , 靖郎 重光
- 申请人： 住友ベークライト株式会社 , 独立行政法人理化学研究所
- 专利权人： 住友ベークライト株式会社,独立行政法人理化学研究所
- 当前专利权人： 住友ベークライト株式会社,独立行政法人理化学研究所
- 优先权： JP14709799 1999-05-26
- 主分类号： G03F7/038
- IPC分类号： G03F7/038 ; H01L21/027 ; C08G73/10 ; G03F7/004 ; G03F7/027 ; G03F7/028
摘要：
PROBLEM TO BE SOLVED: To ensure high sensitivity and resolution and to obtain a resin layer excellent in heat resistance by incorporating a cis-diene substituted polyamic acid having a specified structure unit or a polyimide and an oxygen sensitizer. SOLUTION: The photosensitive resin composition contains a cis-diene substituted polyamic acid having a structural unit of the formula or a polyimide and an oxygen sensitizer. In the formula, at least one of R1-R4 is a monovalent organic group having a cis-diene structure, the remainders are each H, hydroxy, carboxyl, a 1-20C alkyl or a 1-20C alkoxyl, X1 and X2 are each O, S, a 1-4C alkylene or a 1-4C alkyleneoxy, Ar1 and Ar2 are each a divalent aromatic group, l1, l2, m1 and m2 are each 0 or 1, where when l1 is 1, m1 is also 1, and when l2 is 1, m2 is also 1.
公开/授权文献:
- JP2000338668A PHOTOSENSITIVE RESIN COMPOSITION 公开/授权日：2000-12-08