An object of the present invention is to provide a package structure of wire bonding of stacked multi-chip that can be used even if the area difference in each of the laminated chip is large.
A package of wire bonding a stacked multi-chip structure 20 is disposed on the lead frame 203, a first semiconductor chip 201 externally electrically connecting the packaging structure 20, on the first semiconductor chip 201 to be installed, by electrically connecting the first semiconductor chip 201, the second semiconductor chip 202 for controlling the electrical connection operation of the outside of the first semiconductor chip 201 and the package structure 20, on the first semiconductor chip 201 are installed, by being second semiconductor chip 202 and the electrical connection, characterized by comprising a third semiconductor chip 206 and the second semiconductor chip 202 is packaged structure 20 outside the electrical connection in the vicinity of the third semiconductor chip 206 to.
.FIELD 2