基本信息:
- 专利标题：
- 申请号：JP16898995 申请日：1995-07-04
- 公开(公告)号：JP2862814B2 公开(公告)日：1999-03-03
- 发明人： KANESAKA KENJI
- 申请人： NITSUTETSU SEMIKONDAKUTAA KK
- 专利权人： NITSUTETSU SEMIKONDAKUTAA KK
- 当前专利权人： NITSUTETSU SEMIKONDAKUTAA KK
- 优先权： JP16898995 1995-07-04
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/50
摘要：
PROBLEM TO BE SOLVED: To prevent a bonding wire from being short-circuited electrically with a bus bar lead in a semiconductor device of an LOC structure. SOLUTION: In a lead frame 19, an edge part 16b along the length direction on the surface of a bus bar lead 15b which is stridden by a covered bonding wire 11 is made a smooth circumferential face by an etching working operation.
公开/授权文献:
- JPH0922974A LEAD FRAME FOR SEMICONDUCTOR DEVICE AND ITS WORKING METHOD 公开/授权日：1997-01-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |