To provide a molded film in which reduction of conductivity due to tensile force in a molding process and stress under high temperature is suppressed, and which has excellent ion migration resistance between conductive patterns even after molding.SOLUTION: A molded film for forming a printed conductive circuit coated by an insulator layer on a substrate surface having an uneven surface or a three-dimensional curved surface, in which the molded film is a molded film including a conductive layer and an insulator layer on a base film, the conductive layer is a cured product of a conductivity resin composition including resin (A1), conductive particles (D), and cross-linking agent (C1) if required, the insulator layer is a cured product of an insulating resin composition including the resin (A2) and the cross-linking agent (C2), the volume resistivity of the insulator layer is 1×1010 Ω cm or more and less than 1×1017 Ω cm, and the resin (A1) and the resin (A2) have a cross-linkable functional group that can react with the cross-linking agent (C2).SELECTED DRAWING: Figure 1