基本信息:
- 专利标题： 検査治具、及び検査装置
- 专利标题（英）：INSPECTION TOOL AND INSPECTION DEVICE
- 申请号：JP2020131206 申请日：2020-07-31
- 公开(公告)号：JP2021167801A 公开(公告)日：2021-10-21
- 发明人： 津村 耕平 , 山崎 秀和
- 申请人： 日本電産リード株式会社
- 申请人地址： 京都府京都市右京区西京極堤外町10番地
- 专利权人： 日本電産リード株式会社
- 当前专利权人： 日本電産リード株式会社
- 当前专利权人地址： 京都府京都市右京区西京極堤外町10番地
- 代理人： 柳野 隆生; 柳野 嘉秀; 森岡 則夫; 関口 久由; 大西 裕人
- 优先权： JP2020071031 2020-04-10
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01R1/073
To provide an inspection tool and an inspection device which can easily reduce stress on support parts for supporting contacts.SOLUTION: An inspection tool 3 includes: rod-like contacts Pr; a first support part 311 for supporting one end sides of the contacts Pr; a second support part 312 for supporting the other end sides of the contacts Pr; and a separately-holding member 7 for holding the first support part 311 and the second support part 312 separately from each other. The first support part 311 includes a support plate B2 having through holes B2H into which the contacts Pr are inserted. A facing surface of the support plate B2, which faces the second support part 312, has a reinforcement plate 5 with stronger bending strength than that of the support plate B2.SELECTED DRAWING: Figure 3
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/66 | .在制造或处理过程中的测试或测量 |