To provide a prober and a wafer chuck, which sucks to a chuck by correcting a warped wafer and enabling a probing.SOLUTION: First, a warped center of a wrapped wafer W is sucked by a negative pressure supplied to a sucking groove 19 from a vacuum passage 23. Next, it is sucked by the negative pressure supplied to the sucking groove 19 from the vacuum passage 23 toward an outer side from the center of the warped wafer W. Subsequently, a positive pressure is supplied to a bernoulli port hole 41 for 12 inch or a bernoulli port hole 42 for 8 inch in accordance with the size of the wafer W to correct the wrapping on the outer side of the wafer W by causing a bernoulli effect on the outer side of the wafer W. Finally, a positive pressure supply to the bernoulli port hole 41 for 12 inch or the bernoulli port hole 42 for 8 inch is stopped and makes the sucking groove 19 suck the outer side of the wafer W.SELECTED DRAWING: Figure 5