基本信息:
- 专利标题： ポジ型ドライフィルムレジスト及びエッチング方法
- 专利标题（英）：POSITIVE TYPE DRY FILM RESIST AND ETCHING METHOD
- 申请号：JP2020003726 申请日：2020-01-14
- 公开(公告)号：JP2021110876A 公开(公告)日：2021-08-02
- 发明人： 中村 優子 , 入澤 宗利
- 申请人： 三菱製紙株式会社
- 申请人地址： 東京都墨田区両国二丁目10番14号
- 专利权人： 三菱製紙株式会社
- 当前专利权人： 三菱製紙株式会社
- 当前专利权人地址： 東京都墨田区両国二丁目10番14号
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/11 ; G03F7/40 ; G03F7/42 ; H05K3/06 ; G03F7/023
To provide a positive type dry film resist which is excellent in adhesive force between a support film and a peeling layer, suppresses coating unevenness and has uniform thickness, and suppresses pin holes, and an etching method which is excellent in reproducibility of a resist pattern and an etching pattern.SOLUTION: There are provided a positive type dry film resist that is formed by laminating at least (a) a support film, (b) a peeling layer and (c) a positive type photosensitive resist layer in this order, in which (b) the peeling layer contains polyvinyl alcohol and 1 mass% or more and 15 mass% or less of a volatile component, and (c) the positive type photosensitive resist layer contains a novolac resin and quinone diazide sulfonic acid ester as main components; and an etching method using the positive type dry film resist.SELECTED DRAWING: Figure 1
公开/授权文献:
- JPWO2020158929A1 小動物用穿刺具 公开/授权日：2021-12-02