基本信息:
- 专利标题： 導電テープおよびその製造方法
- 专利标题（英）：CONDUCTIVE TAPE AND METHOD FOR MANUFACTURING THE SAME
- 申请号：JP2019209558 申请日：2019-11-20
- 公开(公告)号：JP2021082501A 公开(公告)日：2021-05-27
- 发明人： 後藤 昌利 , 辻本 和久 , 薩摩 英希 , 野坂 敬之
- 申请人： セーレン株式会社
- 申请人地址： 福井県福井市毛矢1丁目10番1号
- 专利权人： セーレン株式会社
- 当前专利权人： セーレン株式会社
- 当前专利权人地址： 福井県福井市毛矢1丁目10番1号
- 主分类号： H05K9/00
- IPC分类号： H05K9/00 ; D06M11/83 ; D06M13/395 ; D06M15/263 ; C09J7/38 ; C09J7/21 ; H01B5/12 ; H01B1/22
To provide a conductive tape for shielding electromagnetic wave of an electronic apparatus, which has both excellent grounding properties and high adhesiveness, and which is less susceptible to discoloration in hot and humid environments.SOLUTION: A conductive tape includes an adhesive film composed of an adhesive which is disposed only at an opening of a conductive mesh fabric composed of yarn whose surface includes a metal film. A part of the metal film is exposed without being covered with the adhesive film on both surfaces of the conductive mesh fabric. A part of the yarn constituting the conductive mesh fabric includes a thermoplastic synthetic fiber monofilament yarn. The metal film has a three-layer structure in which silver, nickel or nickel alloy, and copper are disposed in this order from an outermost surface side.SELECTED DRAWING: Figure 1
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K9/00 | 设备或元件对电场或磁场的屏蔽 |