基本信息:
- 专利标题： 基板貼合装置
- 专利标题（英）：SUBSTRATE STICKING DEVICE
- 申请号：JP2019162027 申请日：2019-09-05
- 公开(公告)号：JP2021040094A 公开(公告)日：2021-03-11
- 发明人： 川田原 奨
- 申请人： キオクシア株式会社
- 申请人地址： 東京都港区芝浦三丁目1番21号
- 专利权人： キオクシア株式会社
- 当前专利权人： キオクシア株式会社
- 当前专利权人地址： 東京都港区芝浦三丁目1番21号
- 代理人： 特許業務法人酒井国際特許事務所
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/683
To provide a substrate sticking device capable of accurately sticking two substrates.SOLUTION: According to one embodiment, there is provided a substrate sticking device comprising a first suction stage, a second suction stage, and an alignment part. The first suction stage sucks a first substrate. The second suction stage is arranged facing the first substrate. The second suction stage sucks a second substrate. The alignment part can be inserted between the first suction stage and the second suction stage. The alignment part includes a base part, a first detection element, and a second detection element. The base part includes a first principal surface and a second principal surface. The second principal surface is a surface on the opposite side of the first principal surface. The first detection element is arranged on the first principal surface. The second detection element is arranged on the second principal surface.SELECTED DRAWING: Figure 1