基本信息:
- 专利标题: 電子デバイス封止用硬化性吸湿性樹脂組成物、樹脂硬化物、電子デバイス、樹脂硬化物の製造方法および電子デバイスの製造方法
- 专利标题(英):Electronic devices for encapsulating curable hygroscopic resin composition, resin cured product, an electronic device, manufacturing method, and a method of manufacturing an electronic device of the cured resin
- 专利标题(中):用于封装可固化吸湿性树脂组合物的电子器件,树脂固化物,该固化的树脂的电子装置的电子装置的制造方法及制造方法
- 申请号:JP2015143814 申请日:2015-07-21
- 公开(公告)号:JP2017025179A 公开(公告)日:2017-02-02
- 发明人: 三枝 哲也
- 申请人: 古河電気工業株式会社
- 申请人地址: 東京都千代田区丸の内二丁目2番3号
- 专利权人: 古河電気工業株式会社
- 当前专利权人: 古河電気工業株式会社
- 当前专利权人地址: 東京都千代田区丸の内二丁目2番3号
- 代理人: 飯田 敏三; 篠田 育男
- 主分类号: C08F2/48
- IPC分类号: C08F2/48 ; H01L23/29 ; H01L23/31 ; C08F2/44
The present invention excellent cured resin sealing properties can be formed, and even more for the use electronic devices sealing the storage stability and handling with excellent electronic device sealing curable hygroscopic resin composition and the composition provision of the curable hygroscopic resin composition.
A radical polymerizable compound (a), hygroscopic compounds having a structure represented by the formula (1) and (b), a photo-radical polymerization initiator (c) a curable electronic device sealing, including hygroscopic resin composition.
(R is an acyl group, a hydrocarbon group, or a carbon of the hydrocarbon group - between carbon bond -O -, - S -, - groups with at least one member selected from CO- or -NH-; M is B or Al; a plurality of R and M are each independently; n is an integer of 1 to 20; * 1 and * 2 are each binding site of the end groups or, coupled to each other)
.BACKGROUND
公开/授权文献:
- JP5996053B1 電子デバイス封止用硬化性吸湿性樹脂組成物、樹脂硬化物、電子デバイス、樹脂硬化物の製造方法および電子デバイスの製造方法 公开/授权日:2016-09-21