The subject matter is directed to electrical contacting of band- or plate-shaped materials (1), which are conveyed by transport track through an electroplating system. The cathodically polarized contact means (6) may be located on the underside of the material (1) in the electrolyte (12) circulated in the electroplating system. The material is electrically contacted to transfer current to the material (1). Each tubular contact means (6) is cooled by means of a cooling unit or a cooling medium. No metal is deposited on the cooled surface of the contact means (6) if the temperature difference between the working temperature of the electrolyte (12) and the surface temperature of the contact means (6) is sufficiently large. This property can be supplemented with a surface of the contact means (6) that cannot be cathodically metal-coated in the electrolyte (12) used.