基本信息:
- 专利标题: Temperature and humidity adjustment mechanism
- 专利标题(中):温度和湿度调节机制
- 申请号:JP2010226243 申请日:2010-10-06
- 公开(公告)号:JP2012080022A 公开(公告)日:2012-04-19
- 发明人: WATANABE KOTARO
- 申请人: Nec Tokin Corp , Necトーキン株式会社 , Tokin Emc Engineering Co Ltd , 株式会社トーキンEmcエンジニアリング
- 专利权人: Nec Tokin Corp,Necトーキン株式会社,Tokin Emc Engineering Co Ltd,株式会社トーキンEmcエンジニアリング
- 当前专利权人: Nec Tokin Corp,Necトーキン株式会社,Tokin Emc Engineering Co Ltd,株式会社トーキンEmcエンジニアリング
- 优先权: JP2010226243 2010-10-06
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
PROBLEM TO BE SOLVED: To provide a temperature and humidity adjustment mechanism capable of extremely reducing an energy cost and a facility cost and also performing measurement with high accuracy.SOLUTION: A temperature and humidity adjustment mechanism includes: a hole 4 arranged at a part of a shield floor 3 in an anechoic chamber 2; temperature and humidity adjustment means 7 arranged outside of the anechoic chamber 2 so as to adjust temperature and humidity; a duct 9 connecting the temperature and humidity adjustment means 7 to the hole 4 so as to perform ventilation; a table 6 arranged between the hole 4 and a tested body 8 and formed of an insulation material; and a cover 5 formed of a transparent insulation material to cover the whole parts of the tested body 8, the hole 4, and the table 6. The table 6 and the cover 5 are detachable from the shield floor 3.
摘要(中):
要解决的问题:提供能够极大地降低能量成本和设备成本并且还以高精度进行测量的温度和湿度调节机构。 解决方案:温湿度调节机构包括:布置在电波暗室2中的屏蔽层3的一部分处的孔4; 温度和湿度调节装置7,布置在消声室2的外部,以调节温度和湿度; 将温度和湿度调节装置7连接到孔4以便进行通风的管道9; 布置在孔4和被测体8之间并由绝缘材料形成的台6; 以及由透明绝缘材料形成以覆盖被测体8,孔4和台6的整个部分的盖5.工作台6和盖5可从屏蔽层3上拆卸。版权所有: (C)2012,JPO&INPIT
公开/授权文献:
- JP5547026B2 Temperature and humidity adjustment mechanism 公开/授权日:2014-07-09
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K9/00 | 设备或元件对电场或磁场的屏蔽 |