发明专利
JP2012001652A Thermosetting fluoropolyether-based adhesive composition and method for bonding the same
有权
基本信息:
- 专利标题: Thermosetting fluoropolyether-based adhesive composition and method for bonding the same
- 专利标题(中):基于氟硅酮的粘合剂组合物的热固化及其结合方法
- 申请号:JP2010139059 申请日:2010-06-18
- 公开(公告)号:JP2012001652A 公开(公告)日:2012-01-05
- 发明人: KOSHIKAWA HIDENORI , SHIONO MIKIO
- 申请人: Shin-Etsu Chemical Co Ltd , 信越化学工業株式会社
- 专利权人: Shin-Etsu Chemical Co Ltd,信越化学工業株式会社
- 当前专利权人: Shin-Etsu Chemical Co Ltd,信越化学工業株式会社
- 优先权: JP2010139059 2010-06-18
- 主分类号: C09J4/02
- IPC分类号: C09J4/02 ; C09J5/06 ; C09J11/06 ; C09J183/05 ; C09J183/06 ; C09J183/12
摘要:
PROBLEM TO BE SOLVED: To provide a thermosetting fluoropolyether-based adhesive composition which cures by a heat treatment of less than 100°C, shows the excellent adhesion to metals, an inorganic substance, and a plastic substrate, and is excellent in a bond durability at less than 100°C, and to provide a method for bonding the composition with a metal, inorganic substance, or plastic substrate.SOLUTION: The thermosetting fluoropolyether-based adhesive composition contains (A) a specific linear polyfluoro compound, (B) a silicon atom-bonded hydrogen atom-containing fluorine-containing organohydrogenpolysiloxane, (C) a platinum group metal-based catalyst, (D) a fluorine-containing organohydrogenpolysiloxane that has a fluorine-containing organic group, a silicon atom-bonded hydrogen atom, an epoxy group and/or trialkoxysilyl group that bonds to a silicon atom through a carbon atom or a carbon atom and an oxygen atom, and an aryl group that bonds to a silicon atom through a carbon atom, (E) a specific organosilicon compound, and (F) an organosilicon compound that has an epoxy group and a silicon atom-bonded alkoxy group.
摘要(中):
要解决的问题:为了提供通过小于100℃的热处理固化的热固性氟聚醚类粘合剂组合物,显示出对金属,无机物质和塑料基材的优异的粘附性,并且在 在低于100℃下的粘合耐久性,以及提供将组合物与金属,无机物质或塑料基材接合的方法。 解决方案:热固性氟聚醚类粘合剂组合物含有(A)特定的线性多氟化合物,(B)含硅原子键合的含氢原子的含氟有机氢聚硅氧烷,(C)铂族金属类催化剂, (D)具有通过碳原子或碳原子和氧键与硅原子键合的含氟有机基团,与硅原子键合的氢原子,环氧基和/或三烷氧基甲硅烷基的含氟有机氢聚硅氧烷 原子和通过碳原子与硅原子键合的芳基,(E)特定的有机硅化合物,和(F)具有环氧基和硅原子键合的烷氧基的有机硅化合物。 版权所有(C)2012,JPO&INPIT
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
C | 化学;冶金 |
--C09 | 染料;涂料;抛光剂;天然树脂;黏合剂;其他类目不包含的组合物;其他类目不包含的材料的应用 |
----C09J | 黏合剂;一般黏合方法(非机械部分);其他类目不包括的黏合方法;黏合剂材料的应用 |
------C09J4/00 | 基于至少具有1个可聚合的碳—碳不饱和键的非高分子有机化合物的黏合剂 |
--------C09J4/02 | .丙烯酰基单体 |