PROBLEM TO BE SOLVED: To provide a film for a flip chip type semiconductor back surface, showing an excellent retaining force in a dicing process of a semiconductor wafer, separating a semiconductor chip from a base material with improved pickup properties along with the film for a flip chip type semiconductor back surface in a pickup process, and suppressing or preventing sticking of the semiconductor chip to a support via the film for a flip chip type semiconductor back surface even if the semiconductor chip having the back surface protected by the film for a flip chip type semiconductor back surface, is placed on the support after the pickup process.
SOLUTION: The film for a flip chip type semiconductor back surface has a multilayer structure including a wafer adhesive layer 22 and a laser mark layer 21, where a modulus of elasticity (at 50°C) of the wafer adhesive layer 22 is not more than 10 MPa and a modulus of elasticity (at 50°C) of the laser mark layer 21 is not less than 100 MPa.
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