PROBLEM TO BE SOLVED: To provide a vacuum molding mold providing an embossed carrier tape reduced in the radius of curvature of a pocket opening part, and housing minute electronic component chip in a predetermined arrangement, and hard to shift the arrangement of the electronic parts, and also to provide a method for manufacturing the carrier tape.
SOLUTION: This male vacuum molding mold for the embossed carrier tape is composed of a side plate A11, a mold 13 and a side plate B12, and is equipped with the following conditions a-d: (a) the mold 13 for forming a male mold is provided to the central part of the groove formed by the groove side 111 and groove base 112 of the side plate A, and the groove side 121 and groove base 122 of the side plate B; (b) a plurality of mold head parts 131 are formed to a mold foot part 132 in width larger than the width 133 of the mold foot part 132 and the cross-sectional shape of the part from the mold foot part 132 to the head parts 131 is a T shape; (c) vacuum holes 14 are provided to the mating surfaces of both side plates 11 and 12 and the mold 13; and (d) gaps are provided between the rears 134 of the mold head parts, and the groove bases 112 and 122 of both side plates.
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