基本信息:
- 专利标题: Exposure equipment
- 专利标题(中):曝光设备
- 申请号:JP2005099416 申请日:2005-03-30
- 公开(公告)号:JP2006278960A 公开(公告)日:2006-10-12
- 发明人: YAMAMOTO SUMIMASA
- 申请人: Canon Inc , キヤノン株式会社
- 专利权人: Canon Inc,キヤノン株式会社
- 当前专利权人: Canon Inc,キヤノン株式会社
- 优先权: JP2005099416 2005-03-30
- 主分类号: H01L21/027
- IPC分类号: H01L21/027
摘要:
PROBLEM TO BE SOLVED: To provide an optical element which is suitable for measurement by extreme ultraviolet rays where it is difficult to use a transmission type optical element, exposure equipment using the optical element, and a device manufacturing method using the exposure equipment.
SOLUTION: The exposure equipment projects a pattern of an original plate to a substrate by the extreme ultraviolet rays from a light source through an optical system. The optical elements are positioned on either the light source side of the original plate in the optical pass from the light source to the substrate or the substrate side of the original plate, and include a film through which the extreme ultraviolet rays are transmitted and a shading member which is located on the film and shades a part of the film.
COPYRIGHT: (C)2007,JPO&INPIT
摘要(中):
SOLUTION: The exposure equipment projects a pattern of an original plate to a substrate by the extreme ultraviolet rays from a light source through an optical system. The optical elements are positioned on either the light source side of the original plate in the optical pass from the light source to the substrate or the substrate side of the original plate, and include a film through which the extreme ultraviolet rays are transmitted and a shading member which is located on the film and shades a part of the film.
COPYRIGHT: (C)2007,JPO&INPIT
要解决的问题:提供一种适用于难以使用透射型光学元件的极紫外线测量的光学元件,使用该光学元件的曝光设备以及使用该曝光设备的设备制造方法 。
解决方案:曝光设备通过光源通过光学系统的极紫外线将原版图案投射到基板。 光学元件位于原版光源侧的从光源到原版的基板或基板侧的光学通路中,并且包括透过极紫外线的膜和阴影 位于电影上的成员遮蔽了电影的一部分。 版权所有(C)2007,JPO&INPIT
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |