基本信息:
- 专利标题: Etching method of copper on the card
- 申请号:JP2003528080 申请日:2002-09-09
- 公开(公告)号:JP2005502785A 公开(公告)日:2005-01-27
- 发明人: ガスト、ビーリングス , ジェニー、ショウバーグ , ビャルニ、ビャルナソン , ヨーラン、フレネッソン
- 申请人: オブデュキャット、アクチボラグObducat Ab
- 专利权人: オブデュキャット、アクチボラグObducat Ab
- 当前专利权人: オブデュキャット、アクチボラグObducat Ab
- 优先权: SE0102994 2001-09-10
- 主分类号: C25F3/02
- IPC分类号: C25F3/02 ; C25F7/00 ; H05K3/07
A cathode (102), by applying a voltage between the card (42) which will form the anode, copper on the card is etched. The cathode (102) and the card (42) is immersed in the electrolyte, the electrolyte, the first state of forming ions having metal atom having an oxidation number of the first positive, than the first oxidation number including small second positive second to state it is reduced or at least a first forming an ion containing a metal atom having an oxidation number of components. The first redox potential of the electrolyte for reduction from the first state to the second state, from the second oxidation-reduction potential of the electrolytic solution for reducing divalent copper ions to metallic copper large. During the etching, while the first component is reduced from a first state to a second state, metallic copper on the card is oxidized, are converted to positively charged copper ions. Since the metal of the copper is not precipitated on the cathode, thereby improving the quality of the etched structure on the card.
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EspacenetIPC结构图谱:
C | 化学;冶金 |
--C25 | 电解或电泳工艺;其所用设备 |
----C25F | 电解法除去物体上材料的方法;其所用的设备 |
------C25F3/00 | 电解浸蚀或抛光 |
--------C25F3/02 | .浸蚀 |