PROBLEM TO BE SOLVED: To provide an apparatus and a method for thermally and/or electrically connecting electronic components. SOLUTION: A method and an apparatus for forming an electric and/or heat conductive interconnection are disclosed. In this connection, a first surface and a second surface are brought into contact with each other through a nanostructure arranged on at lest one surface thereof. In an embodiment, there are exemplified a first plurality of regions of nanostructures in a component in an electronic package such as a microprocessor. Then, the first plurality of regions are brought into contact with corresponding a second plurality of regions of nanostructures on a substrate, to cause strong friction coupling. In the other embodiment as exemplification, the plurality of nanostructures are arranged on the component such as a microprocessor, and such nanostructures are brought into contact with the substrate. An intermolecular force permits the application of an attracting force between a molecule of the nanostructure and a molecule of the substrate, thereby establishing coupling between the nanostructure and the substrate. COPYRIGHT: (C)2006,JPO&NCIPI