基本信息:
- 专利标题： Conductive ball feeder and feeding method
- 专利标题（中）：导电球进料器和进料方法
- 申请号：JP2003417644 申请日：2003-12-16
- 公开(公告)号：JP2005183423A 公开(公告)日：2005-07-07
- 发明人： ITO MOTOMICHI , OCHIAI MASANORI
- 申请人： Hitachi Metals Ltd , 日立金属株式会社
- 专利权人： Hitachi Metals Ltd,日立金属株式会社
- 当前专利权人： Hitachi Metals Ltd,日立金属株式会社
- 优先权： JP2003417644 2003-12-16
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60
摘要：
PROBLEM TO BE SOLVED: To provide conductive ball feeder and feeding method capable of feeding micro conductive balls to a predetermined region of an electronic component manufacturing apparatus while suppressing occurrence of surface defect or deformation.
SOLUTION: The conductive ball feeder for feeding conductive balls to a feed region being set in an electronic component manufacturing apparatus comprises a ball supplying means for supplying the conductive balls at a conductive ball supply position, and a ball feeding means for carrying the conductive balls supplied at the ball supply position to a ball feed position for feeding the conductive balls to the feed region while distributing and holding wherein the ball feeding means is arranged above the feed region at least through an interval capable of passing the conductive balls.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要（中）：
SOLUTION: The conductive ball feeder for feeding conductive balls to a feed region being set in an electronic component manufacturing apparatus comprises a ball supplying means for supplying the conductive balls at a conductive ball supply position, and a ball feeding means for carrying the conductive balls supplied at the ball supply position to a ball feed position for feeding the conductive balls to the feed region while distributing and holding wherein the ball feeding means is arranged above the feed region at least through an interval capable of passing the conductive balls.
COPYRIGHT: (C)2005,JPO&NCIPI
要解决的问题：提供一种能够在抑制表面缺陷或变形的发生的同时将微小导电球供给到电子部件制造装置的规定区域的导电性球给料机和进给方式。 解决方案：用于将导电球馈送到设置在电子部件制造装置中的进给区域的导电球进料器包括：用于在导电球供给位置处供给导电球的球供给装置，以及用于承载 在球供给位置提供的导电球至球进给位置，用于在分配和保持时将导电球馈送到进给区域，其中球进给装置至少通过能够通过导电球的间隔布置在进料区上方。 版权所有（C）2005，JPO＆NCIPI
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |