基本信息:
- 专利标题： Heatsink member and apparatus module equipped therewith
- 专利标题（中）：装备会员及装置装置
- 申请号：JP2003200195 申请日：2003-07-23
- 公开(公告)号：JP2005044841A 公开(公告)日：2005-02-17
- 发明人： NODA KENJI , OKAMOTO KAZUHIRO
- 申请人： Kyocera Corp , 京セラ株式会社
- 专利权人： Kyocera Corp,京セラ株式会社
- 当前专利权人： Kyocera Corp,京セラ株式会社
- 优先权： JP2003200195 2003-07-23
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L23/373
摘要：
PROBLEM TO BE SOLVED: To provide a heatsink member which is high in electrical conductivity in a specific direction capable of easily adjusting a thermal expansion coefficient, and applied to a printed wiring board used for an electronic apparatus. SOLUTION: A member used as a heatsink 2 for dissipating heat released from a heating part 5 is formed of composite structures 13 which are each composed of composite fibers 11 that consist of core material 9, which is of continuous length and formed of covalent bonding ceramic sintered material and facing material 10 of metal or sintered alloy covering the circumference of the core material 9 and are arranged in groups each composed of a plurality of composite fibers 11 bound in one direction. COPYRIGHT: (C)2005,JPO&NCIPI
摘要（中）：
要解决的问题：提供一种在能够容易地调节热膨胀系数的特定方向上的导电性高的散热构件，并且应用于用于电子设备的印刷线路板。 解决方案：用作耗散从加热部件5释放的热量的散热片2的部件由复合结构13形成，复合结构13由复合纤维11组成，复合纤维11由连续长度的芯材9组成， 共价键合陶瓷烧结材料和覆盖芯材9的圆周的金属或烧结合金的面材10，并且分别组成由多个沿一个方向结合的复合纤维11组成的组。 版权所有（C）2005，JPO＆NCIPI
公开/授权文献:
- JP4116942B2 Members and equipment modules having a heat sink for this 公开/授权日：2008-07-09
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
| --------H05K7/20 | .便于冷却、通风或加热的改进 |